Invention Grant
- Patent Title: Method of fast surface particle and scratch detection for EUV mask backside
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Application No.: US17094727Application Date: 2020-11-10
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Publication No.: US11768431B2Publication Date: 2023-09-26
- Inventor: Chih-Cheng Chen , ShinAn Ku , Ting-Hao Hsu , Hsin-Chang Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: G03F1/22
- IPC: G03F1/22 ; G01B11/24 ; G01B11/22 ; G01J3/02

Abstract:
A method of scanning a substrate and determining scratches of the substrate includes transmitting a converging beam of light that comprises multiple wavelengths to the substrate. Each wavelength of the multiple wavelengths focuses at a different distance in a focus interval around and including a surface of the substrate. The method also includes receiving reflected light from the surface of the substrate and determining a height or depth of the surface of the substrate based on a wavelength of the reflected light having a highest intensity.
Public/Granted literature
- US20210200077A1 METHOD OF FAST SURFACE PARTICLE AND SCRATCH DETECTION FOR EUV MASK BACKSIDE Public/Granted day:2021-07-01
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