Invention Grant
- Patent Title: Connection interface conversion chip, connection interface conversion device and operation method
-
Application No.: US17827804Application Date: 2022-05-30
-
Publication No.: US11768786B2Publication Date: 2023-09-26
- Inventor: Cheng-Chung Lin , Hsiao-Chyi Lin , Yi-Shing Lin , Chien-Sheng Chen
- Applicant: VIA LABS, INC.
- Applicant Address: TW New Taipei
- Assignee: VIA LABS, INC.
- Current Assignee: VIA LABS, INC.
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW 9134523 2020.10.06
- Main IPC: G06F13/38
- IPC: G06F13/38 ; G06F13/42
Abstract:
A connection interface conversion chip, a connection interface conversion device and an operation method are provided. The connection interface conversion chip includes a USB interface circuit, a DP interface circuit, a USB core circuit and a switching circuit. The USB interface circuit is suitable for coupling to a USB connector. The DP interface circuit is coupled to a DP sink device through a DP connector. The USB core circuit is coupled to both the USB interface circuit and the DP interface circuit. The switching circuit is coupled to both the USB interface circuit and the DP interface circuit. The switching circuit supports only one specific conduction mode that only allows transmitting DP signals between the USB interface circuit and the DP interface circuit.
Public/Granted literature
- US20220292039A1 CONNECTION INTERFACE CONVERSION CHIP, CONNECTION INTERFACE CONVERSION DEVICE AND OPERATION METHOD Public/Granted day:2022-09-15
Information query
