Invention Grant
- Patent Title: Security plugin for a system-on-a-chip platform
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Application No.: US17679009Application Date: 2022-02-23
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Publication No.: US11768964B2Publication Date: 2023-09-26
- Inventor: Manoj R. Sastry , Alpa Narendra Trivedi , Men Long
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: JAFFERY WATSON MENDONSA & HAMILTON LLP
- Main IPC: G06F21/72
- IPC: G06F21/72 ; G09C1/00 ; G06F21/85 ; H04L9/06 ; H04L9/08

Abstract:
Systems and techniques for a System-on-a-Chip (SoC) security plugin are described herein. A component message may be received at an interconnect endpoint from an SoC component. The interconnect endpoint may pass the component message to a security component via a security interlink. The security component may secure the component message, using a cryptographic engine, to create a secured message. The secured message is delivered back to the interconnect endpoint via the security interlink and transmitted across the interconnect by the interconnect endpoint.
Public/Granted literature
- US20220405427A1 SECURITY PLUGIN FOR A SYSTEM-ON-A-CHIP PLATFORM Public/Granted day:2022-12-22
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