Invention Grant
- Patent Title: Reduced area standard cell abutment configurations
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Application No.: US17558157Application Date: 2021-12-21
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Publication No.: US11768989B2Publication Date: 2023-09-26
- Inventor: Chi-Yu Lu , Hui-Zhong Zhuang , Pin-Dai Sue , Yi-Hsin Ko , Li-Chun Tien
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G06F30/392
- IPC: G06F30/392 ; G06F30/398

Abstract:
A method of designing a semiconductor device including the operations of analyzing a vertical abutment between a first standard cell block and a second cell block and, if a mismatch is identified between the first standard cell block and the second cell block initiating the selection of a first modified cell block that reduces the mismatch and a spacing between the first modified cell block and the second cell block, the first modified cell block comprising a first abutment region having a continuous active region arranged along a first axis parallel to an edge of the vertical abutment, and replacing the first standard cell block with the first modified cell block to obtain a first modified layout design and devices manufactured according to the method.
Public/Granted literature
- US20220114322A1 REDUCED AREA STANDARD CELL ABUTMENT CONFIGURATIONS Public/Granted day:2022-04-14
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