Invention Grant
- Patent Title: Coil electronic component
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Application No.: US16593709Application Date: 2019-10-04
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Publication No.: US11769624B2Publication Date: 2023-09-26
- Inventor: Young Il Lee , Jeong Gu Yeo , Ji Hoon Hwang , Myoung Ki Shin , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20180166350 2018.12.20
- Main IPC: H01F27/24
- IPC: H01F27/24 ; H01F27/32 ; H01F27/29 ; H01F27/28

Abstract:
A coil electronic component includes a body including a coil portion disposed therein, and including a plurality of magnetic particles, and external electrodes connected to the coil portion. The body includes an internal region and a protective layer disposed on a surface of the internal region. A first particle of the plurality of magnetic particles included in the protective layer includes an oxide film disposed on a surface of the first particle, and a second particle, having a size greater than a size of the first particle, of the plurality of magnetic particles includes a coating layer disposed on a surface of the second particle and having a composition different from a composition of the oxide film.
Information query