Invention Grant
- Patent Title: Dielectric material, method of preparing the same, and device comprising the same
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Application No.: US17165300Application Date: 2021-02-02
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Publication No.: US11769630B2Publication Date: 2023-09-26
- Inventor: Taewon Jeong , Hyeon Cheol Park , Daejin Yang , Doh Won Jung , Giyoung Jo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: HARNESS, DICKEY & PIERCE, P.L.C.
- Priority: KR 20200090571 2020.07.21
- Main IPC: H01G4/12
- IPC: H01G4/12 ; C04B35/497 ; G11C11/22 ; H01L49/02 ; H10B53/00
Abstract:
Provided are a dielectric material including a compound represented by Formula 1, a device including the same, and a method of preparing the dielectric material:
(1−x)KaNabNbO3.xM(AcSbd)O3 [Formula 1]
wherein, in Formula 1, M is a Group 2 element, A is a trivalent element, and 0
(1−x)KaNabNbO3.xM(AcSbd)O3 [Formula 1]
wherein, in Formula 1, M is a Group 2 element, A is a trivalent element, and 0
Public/Granted literature
- US20220028613A1 DIELECTRIC MATERIAL, METHOD OF PREPARING THE SAME, AND DEVICE COMPRISING THE SAME Public/Granted day:2022-01-27
Information query
