Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US17592840Application Date: 2022-02-04
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Publication No.: US11769631B2Publication Date: 2023-09-26
- Inventor: In Kyung Jung , Dong Hwi Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20190108007 2019.09.02
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/12

Abstract:
A multilayer ceramic electronic component includes a ceramic body; and first and second external electrodes disposed on the ceramic body, wherein the first and second external electrodes include first and second conductive layers disposed on corners of the ceramic body, and first and second base electrodes covering the first and second conductive layers, respectively, and wherein a ratio, A1/A2, of an area, A1, of the first conductive layer disposed on the fifth surface or the second conductive layer disposed on the sixth surface of the ceramic body to an area, A2, of a cross-sectional surface of the ceramic body taken in the second direction and the first direction is in a range of 0.1 to 0.3.
Public/Granted literature
- US20220157529A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2022-05-19
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