Invention Grant
- Patent Title: Semiconductor device and method of manufacturing same
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Application No.: US17171173Application Date: 2021-02-09
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Publication No.: US11769703B2Publication Date: 2023-09-26
- Inventor: Mitsuhiro Sakuma
- Applicant: ABLIC Inc.
- Applicant Address: JP Tokyo
- Assignee: ABLIC INC.
- Current Assignee: ABLIC INC.
- Current Assignee Address: JP Nagano
- Agency: Crowell & Moring LLP
- Priority: JP 20021132 2020.02.12
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/495 ; H01L21/56 ; H01L21/66 ; H01L21/48
Abstract:
A semiconductor element is mounted on a die pad, and electrode pads arranged at an outer circumference of a surface of the semiconductor element are electrically connected to leads by wires, respectively. The semiconductor element, the die pad, and the leads are covered with an encapsulating resin. The semiconductor element has an element region having a high sensitivity with respect to stress, and an element region having a relatively low sensitivity with respect to stress. A recessed portion is formed in a surface of the encapsulating resin at a position above the element region having a high sensitivity with respect to stress.
Public/Granted literature
- US20210249320A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2021-08-12
Information query
IPC分类:
