Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17727246Application Date: 2022-04-22
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Publication No.: US11769715B2Publication Date: 2023-09-26
- Inventor: Masanari Seki , Daisuke Koike , Masahiko Hori
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Allen & Overy LLP
- Priority: JP 19163440 2019.09.06
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00
Abstract:
The semiconductor device of the present embodiment includes a lead frame having a projection portion, the projection portion having an upper face and a side face, a semiconductor chip provided above the projection portion, and a bonding material provided between the projection portion and the semiconductor chip, the bonding material being in contact with the upper face and the side face, the bonding material bonding the lead frame and the semiconductor chip.
Public/Granted literature
- US20220246504A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-08-04
Information query
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