Invention Grant
- Patent Title: Circuit board, semiconductor device, and electronic apparatus
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Application No.: US16981494Application Date: 2019-03-08
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Publication No.: US11769777B2Publication Date: 2023-09-26
- Inventor: Takashi Miyamoto , Yoshiyuki Akiyama , Junichi Tsunoda , Shuuichi Kojima , Akira Arahata
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross PC
- Priority: JP 18056247 2018.03.23
- International Application: PCT/JP2019/009243 2019.03.08
- International Announcement: WO2019/181548A 2019.09.26
- Date entered country: 2020-09-16
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/498

Abstract:
The present technology relates to a circuit board, a semiconductor device, and an electronic apparatus that reduce the generation of noise signals. A circuit board includes: a first conductor layer that has a first conductor portion including a conductor having a planar or mesh-like first basic pattern repeatedly disposed in the same plane; and a second conductor layer that has a second conductor portion including a conductor having a planar or mesh-like second basic pattern repeatedly disposed in the same plane, and a third conductor portion including a conductor having a planar, linear, or mesh-shaped third basic pattern repeatedly disposed in the same plane. The repeating cycles of the first and second basic patterns are substantially the same cycles, and the third basic pattern is different than the second basic pattern. The present technology can be applied to a circuit board of a semiconductor device and the like, for example.
Public/Granted literature
- US20210036041A1 CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2021-02-04
Information query
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