Invention Grant
- Patent Title: Solid-state imaging element and imaging apparatus
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Application No.: US17047654Application Date: 2019-04-08
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Publication No.: US11769782B2Publication Date: 2023-09-26
- Inventor: Shunsuke Maruyama , Hideki Minari
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: CHIP LAW GROUP
- Priority: JP 18088561 2018.05.02
- International Application: PCT/JP2019/015254 2019.04.08
- International Announcement: WO2019/211968A 2019.11.07
- Date entered country: 2020-10-14
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A solid-state imaging element including a photoelectric conversion layer of a first electrical conductivity type including a plurality of pixel regions, an electrode electrically coupled to the photoelectric conversion layer and provided for each of the pixel regions, a semiconductor layer provided between the electrode and the photoelectric conversion layer and having a bandgap larger than a bandgap of the photoelectric conversion layer, a diffusion part disposed in a vicinity of an edge of the pixel region and including an impurity of a second electrical conductivity type that is diffused from the semiconductor layer across the photoelectric conversion layer, and a non-diffusion part provided inside the diffusion part and not including the impurity of the second electrical conductivity type in the photoelectric conversion layer.
Public/Granted literature
- US20210043677A1 SOLID-STATE IMAGING ELEMENT AND IMAGING APPARATUS Public/Granted day:2021-02-11
Information query
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