Invention Grant
- Patent Title: Method of manufacturing a field effect transistor using carbon nanotubes and a field effect transistor
-
Application No.: US17397432Application Date: 2021-08-09
-
Publication No.: US11769798B2Publication Date: 2023-09-26
- Inventor: Matthias Passlack , Marcus Johannes Henricus Van Dal , Timothy Vasen , Georgios Vellianitis
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- The original application number of the division: US16516181 2019.07.18
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; H01L29/08 ; H01L29/66 ; H01L29/78

Abstract:
In a method of forming a gate-all-around field effect transistor (GAA FET), a fin structure is formed. The fin structure includes a plurality of stacked structures each comprising a dielectric layer, a CNT over the dielectric layer, a support layer over the CNT. A sacrificial gate structure is formed over the fin structure, an isolation insulating layer is formed, a source/drain opening is formed by patterning the isolation insulating layer, the support layer is removed from each of the plurality of stacked structures in the source/drain opening, and a source/drain contact layer is formed in the source/drain opening. The source/drain contact is formed such that the source/drain contact is in direct contact with only a part of the CNT and a part of the dielectric layer is disposed between the source/drain contact and the CNT.
Public/Granted literature
- US20210376079A1 METHOD OF MANUFACTURING A FIELD EFFECT TRANSISTOR USING CARBON NANOTUBES AND A FIELD EFFECT TRANSISTOR Public/Granted day:2021-12-02
Information query
IPC分类: