Invention Grant
- Patent Title: Semiconductor device including fin and method for manufacturing the same
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Application No.: US17734457Application Date: 2022-05-02
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Publication No.: US11769803B2Publication Date: 2023-09-26
- Inventor: Sungmin Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20200038151 2020.03.30
- The original application number of the division: US17068390 2020.10.12
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L29/16 ; H01L29/78

Abstract:
A semiconductor device includes a substrate; and a fin protruding from the substrate. The fin includes a first material and a second material. The fin includes a lower section, a middle section, and an upper section. The middle section has a smaller width at a middle portion than a width at lower and upper portions of the middle section. A concentration of the second material gradually decreases from the middle portion in upward and downward directions.
Public/Granted literature
- US20220271129A1 SEMICONDUCTOR DEVICE INCLUDING FIN AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-08-25
Information query
IPC分类: