Invention Grant
- Patent Title: Method of manufacturing semiconductor device and associated memory device
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Application No.: US17749165Application Date: 2022-05-20
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Publication No.: US11769804B2Publication Date: 2023-09-26
- Inventor: Nuo Xu , Zhiqiang Wu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: G11C16/04
- IPC: G11C16/04 ; H01L21/28 ; H01L29/66 ; H01L29/78 ; H01L29/51 ; G11C11/22 ; H10B51/20 ; H10B51/30

Abstract:
A method includes providing a substrate including a channel region, the substrate comprising a two-stage structure having a first surface, a second surface higher than the first surface and a third surface connected between the first surface and the second surface; covering the substrate from a top thereof with an oxide layer; forming a ferroelectric material strip on a topmost surface of the oxide layer; and forming a gate strip covering the ferroelectric material strip and the oxide layer from a top of the gate strip.
Public/Granted literature
- US20220278208A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ASSOCIATED MEMORY DEVICE Public/Granted day:2022-09-01
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