Invention Grant
- Patent Title: Photo sensing device and method of fabricating the photo sensing device
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Application No.: US17838386Application Date: 2022-06-13
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Publication No.: US11769845B2Publication Date: 2023-09-26
- Inventor: Chan-Hong Chern , Weiwei Song , Chih-Chang Lin , Lan-Chou Cho , Min-Hsiang Hsu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: H01L31/0352
- IPC: H01L31/0352 ; H01L31/18 ; H01L31/105 ; G01J1/42

Abstract:
The present disclosure provides a photo sensing device, the photo sensing device includes a substrate, including a silicon layer at a front surface, a photosensitive member extending into and at least partially surrounded by the silicon layer, a first doped region having a first conductivity type at a first side of the photosensitive member, wherein the first doped region is in the silicon layer, and a second doped region having a second conductivity type different from the first conductivity type at a second side of the photosensitive member opposite to the first side, wherein the second doped region is in the silicon layer, and the first doped region is apart from the second doped region, and a superlattice layer disposed between the photosensitive member and the silicon layer, wherein the superlattice layer includes a first material and a second material different from the first material.
Public/Granted literature
- US20220328707A1 PHOTO SENSING DEVICE AND METHOD OF FABRICATING THE PHOTO SENSING DEVICE Public/Granted day:2022-10-13
Information query
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