Invention Grant
- Patent Title: Semiconductor light-emitting element and method of manufacturing semiconductor light-emitting element
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Application No.: US17244211Application Date: 2021-04-29
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Publication No.: US11769860B2Publication Date: 2023-09-26
- Inventor: Noritaka Niwa , Tetsuhiko Inazu
- Applicant: NIKKISO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NIKKISO CO., LTD.
- Current Assignee: NIKKISO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JP 20084536 2020.05.13
- Main IPC: H01L33/32
- IPC: H01L33/32 ; H01L33/38 ; H01L33/00 ; H01L33/14

Abstract:
The semiconductor light-emitting element has an n-type semiconductor layer; an active layer provided on a first upper surface of the n-type semiconductor layer; a p-type semiconductor layer provided on the active layer; a p-side contact electrode provided in contact with the upper surface of the p-type semiconductor layer; a p-side current diffusion layer provided on the p-side contact electrode in a region narrower than a formation region of the p-side contact electrode; a p-side pad electrode provided on the p-side current diffusion layer; an n-side contact electrode provided in contact with a second upper surface of the n-type semiconductor layer; an n-side current diffusion layer provided on the n-side contact electrode over a region wider than a formation region of the n-side contact electrode, and including a TiN layer; and an n-side pad electrode provided on the n-side current diffusion layer.
Public/Granted literature
- US20210359161A1 SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT Public/Granted day:2021-11-18
Information query
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