Invention Grant
- Patent Title: Method of manufacturing wire with terminal
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Application No.: US17511678Application Date: 2021-10-27
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Publication No.: US11769963B2Publication Date: 2023-09-26
- Inventor: Kazuki Mano , Kenji Osada
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 20180516 2020.10.28
- Main IPC: H01R13/52
- IPC: H01R13/52 ; B29C35/08

Abstract:
Provided is a method of manufacturing a wire with a terminal, the wire with a terminal including a wire, a metal terminal, and a sealing member obtained by curing an anti-corrosive material, the method using a manufacturing apparatus for the wire with a terminal including a transparent mold including a cavity portion, and a protruding portion that protrudes into the cavity portion, the method including an introducing step of placing, in the cavity portion, a non-sealed wire with a terminal before including the sealing member including the wire and the metal terminal, and introducing the anti-corrosive material into the cavity portion; and an irradiating step of irradiating the anti-corrosive material in the cavity portion with ultraviolet light through the transparent mold.
Public/Granted literature
- US20220131311A1 METHOD OF MANUFACTURING WIRE WITH TERMINAL Public/Granted day:2022-04-28
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