Invention Grant
- Patent Title: Assembly system
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Application No.: US16701648Application Date: 2019-12-03
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Publication No.: US11769978B2Publication Date: 2023-09-26
- Inventor: Yingcong Deng , Dandan Zhang , Lvhai Hu , An Yang , Jian Cao , Yun Liu , Roberto Franciso-Yi Lu , Yuting He , Haidong Wu , Hui Xiao
- Applicant: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Kunshan League Automechanism Co., Ltd.
- Applicant Address: CN PA Shanghai
- Assignee: TE Connectivity Solutions GmbH Tyco,Electronics (Shanghai) Co., Ltd.,Kunshan League Automechanism Co., Ltd.
- Current Assignee: TE Connectivity Solutions GmbH Tyco,Electronics (Shanghai) Co., Ltd.,Kunshan League Automechanism Co., Ltd.
- Current Assignee Address: CH Schaffhausen; CN Shanghai; CN Kunshan
- Agency: Barley Snyder
- Priority: CN 1811465525.7 2018.12.03
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H01R43/20 ; B25J9/00 ; H01R43/18 ; H01R13/506

Abstract:
An assembly system includes a robot, a first gripper mounted on the robot, the first gripper gripping a first housing, and a first clamping device clamping a cable and a contact connected to an end of the cable. The robot moves the first gripper and assembles the first housing gripped by the first gripper onto the contact held by the first clamping device.
Public/Granted literature
- US20200176941A1 Assembly System Public/Granted day:2020-06-04
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