Invention Grant
- Patent Title: Radio-frequency module
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Application No.: US17501002Application Date: 2021-10-14
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Publication No.: US11770153B2Publication Date: 2023-09-26
- Inventor: Masashi Hayakawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: KEATING & BENNETT, LLP
- Main IPC: H04B1/44
- IPC: H04B1/44 ; H03K17/693

Abstract:
A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.
Public/Granted literature
- US20220038131A1 RADIO-FREQUENCY MODULE Public/Granted day:2022-02-03
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