Invention Grant
- Patent Title: Microphone boom rotation mechanism for headsets
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Application No.: US17705113Application Date: 2022-03-25
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Publication No.: US11770646B2Publication Date: 2023-09-26
- Inventor: Wen Tang
- Applicant: Plantronics, Inc.
- Applicant Address: US CA Santa Cruz
- Assignee: Plantronics, Inc.
- Current Assignee: Plantronics, Inc.
- Current Assignee Address: US CA Santa Cruz
- Agency: Quarles & Brady LLP
- Priority: CN 2110333347.8 2021.03.29
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R1/08
Abstract:
A communication headset includes an earcup, a headband, and a microphone boom assembly. The microphone boom assembly includes a microphone boom, a gear assembly disposed on the earcup and supporting the microphone. The gear assembly enables a rotation of the microphone boom.
Public/Granted literature
- US20220312094A1 MICROPHONE BOOM ROTATION MECHANISM FOR HEADSETS Public/Granted day:2022-09-29
Information query
