Invention Grant
- Patent Title: Printed circuit board
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Application No.: US17224615Application Date: 2021-04-07
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Publication No.: US11770894B2Publication Date: 2023-09-26
- Inventor: Hiroki Okada
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200091153 2020.07.22
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
A printed circuit board includes a rigid region and a flexible region; a first substrate disposed on the rigid region and the flexible region and comprising a first insulating layer and a first wiring layer comprising a first groove in the flexible region; and a second substrate disposed on the first substrate in the rigid region and comprising a first adhesive layer, a second insulating layer and a second wiring layer.
Public/Granted literature
- US20220030704A1 PRINTED CIRCUIT BOARD Public/Granted day:2022-01-27
Information query