Invention Grant
- Patent Title: Substrate structure and electronic device including the same
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Application No.: US16902738Application Date: 2020-06-16
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Publication No.: US11770898B2Publication Date: 2023-09-26
- Inventor: Seung Eun Lee , Yong Hoon Kim , Jin Won Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20200030246 2020.03.11
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/14 ; H05K1/11 ; H01L23/498

Abstract:
A substrate structure includes a first printed circuit board having a first side and a second side opposing each other, and a plurality of passive components connected to the first side of the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components of the plurality of first passive components and a smallest distance between adjacent second passive components of the plurality of second passive components. An electronic device includes a first printed circuit board disposed on a mainboard and having, on opposite sides thereof, a semiconductor chip and a plurality of passive components.
Public/Granted literature
- US20210289629A1 SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2021-09-16
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