Invention Grant
- Patent Title: Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same
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Application No.: US17426310Application Date: 2019-12-24
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Publication No.: US11770904B2Publication Date: 2023-09-26
- Inventor: Yuki Kitai , Takeshi Okamoto
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. , Fukuda Metal Foil & Powder Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.,FUKUDA METAL FOIL & POWDER CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.,FUKUDA METAL FOIL & POWDER CO., LTD.
- Current Assignee Address: JP Osaka; JP Kyoto
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP 19018095 2019.02.04
- International Application: PCT/JP2019/050697 2019.12.24
- International Announcement: WO2020/162068A 2020.08.13
- Date entered country: 2021-07-28
- Main IPC: B32B3/00
- IPC: B32B3/00 ; H05K3/38 ; H05K1/09

Abstract:
A surface treated copper foil includes: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and a silane coupling agent treatment layer on the rust prevention treatment layer. An amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.
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