Invention Grant
- Patent Title: Semiconductor device
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Application No.: US18083894Application Date: 2022-12-19
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Publication No.: US11770922B2Publication Date: 2023-09-26
- Inventor: Fei Zhou
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN 1810993685.2 2018.08.29
- The original application number of the division: US16554964 2019.08.29
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L27/088 ; H01L29/06 ; H01L29/66 ; H01L29/78 ; H10B10/00 ; H01L21/02 ; H01L21/768 ; H01L21/3213 ; H01L21/8234

Abstract:
Semiconductor device is provided. The semiconductor device includes a base substrate including a first region, a second region, and a third region, a first doped layer in the base substrate at the first region and a second doped layer in the base substrate at the third region, a first gate structure on the base substrate at the second region, a first dielectric layer on the base substrate, a first conductive layer on the first conductive layer and the second doped layer, a second conductive layer on a surface of the first conductive layer, and a third conductive layer on a contact region of the first gate structure. The second region is between the first region and the third region. The contact region is at a top of the first gate structure. A minimum distance between the second conductive layer and the third conductive layer is greater than zero.
Public/Granted literature
- US20230124829A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-04-20
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