Invention Grant
- Patent Title: Semiconductor devices including an edge insulating layer
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Application No.: US17530818Application Date: 2021-11-19
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Publication No.: US11770926B2Publication Date: 2023-09-26
- Inventor: Junhyeok Ahn , Kiseok Lee , Huijung Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR 20210049519 2021.04.16
- Main IPC: H10B12/00
- IPC: H10B12/00

Abstract:
A semiconductor device includes: a substrate including a cell area and an interface area; a gate electrode disposed in the substrate within the cell area and extending in a first direction; a plurality of bit lines intersecting the gate electrode and extending in a second direction intersecting the first direction, wherein the plurality of bit lines includes a plurality of first bit lines and a plurality of second bit lines alternately disposed in the first direction; edge spacers disposed within the interface area and contacting the plurality of second bit lines; and edge insulating layers disposed between the edge spacers and contacting the plurality of first bit lines, wherein at least a portion of each of the edge insulating layers is disposed within the interface area.
Public/Granted literature
- US20220336464A1 SEMICONDUCTOR DEVICES INCLUDING AN EDGE INSULATING LAYER Public/Granted day:2022-10-20
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