Invention Grant
- Patent Title: Glass assembly including a conductive feature and method of manufacturing thereof
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Application No.: US17860576Application Date: 2022-07-08
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Publication No.: US11773011B1Publication Date: 2023-10-03
- Inventor: Jiangping Wang , Joel Smith , Timothy D. Peck , Frederick Maurice Schaible, III , Abdelhalim Mohamed , Christopher A. Imeson
- Applicant: AGC Automotive Americas Co.
- Applicant Address: US GA Alpharetta
- Assignee: AGC Automotive Americas Co.
- Current Assignee: AGC Automotive Americas Co.
- Current Assignee Address: US GA Alpharetta
- Agency: Howard & Howard Attorneys PLLC
- Main IPC: C03C17/00
- IPC: C03C17/00 ; B32B17/10 ; B32B38/00 ; B32B37/24 ; C03C17/28

Abstract:
A method of manufacturing a glass assembly to have a conductive feature includes a step of forming a glass substrate that is curved. The method also includes digitally-applying a conductive ink without a mask onto a surface of the curved glass substrate. The method further includes curing the conductive ink to form the conductive feature on the surface of the curved glass substrate, with the conductive feature having a resolution of greater than 200 dots per inch.
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