Invention Grant
- Patent Title: Conductive polymer composition
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Application No.: US17296322Application Date: 2019-12-13
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Publication No.: US11773276B2Publication Date: 2023-10-03
- Inventor: Takeshi Miyamoto
- Applicant: SOKEN CHEMICAL & ENGINEERING Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: SOKEN CHEMICAL & ENGINEERING CO., LTD.
- Current Assignee: SOKEN CHEMICAL & ENGINEERING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Maier & Maier, PLLC
- Priority: JP 18236954 2018.12.19
- International Application: PCT/JP2019/048994 2019.12.13
- International Announcement: WO2020/129854A 2020.06.25
- Date entered country: 2021-12-07
- Main IPC: C09D5/24
- IPC: C09D5/24 ; C09D7/20 ; C09D7/63 ; C08G61/12 ; C08K5/41 ; C09D165/00

Abstract:
A conductive polymer composition having the resistance to moisture and heat in the coating film is provided. A conductive polymer composition comprising a solvent and a π-conjugated conductive polymer is provided. A vinyl sulfone group-containing compound containing a vinyl sulfone group as a dopant of the conductive polymer or an additive is included and when the conductive polymer composition contains the vinyl sulfone group-containing compound as the additive, the vinyl sulfone group-containing compound contains a plurality of vinyl sulfone groups.
Public/Granted literature
- US20220220321A1 CONDUCTIVE POLYMER COMPOSITION Public/Granted day:2022-07-14
Information query
IPC分类: