Invention Grant
- Patent Title: Hinge module and electronic device
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Application No.: US17155028Application Date: 2021-01-21
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Publication No.: US11773635B2Publication Date: 2023-10-03
- Inventor: Chih-Ying Lin
- Applicant: QISDA CORPORATION
- Applicant Address: TW Taoyuan
- Assignee: Qisda Corporation
- Current Assignee: Qisda Corporation
- Current Assignee Address: TW Taoyuan
- Priority: CN 2010105834.4 2020.02.19
- Main IPC: E05D11/08
- IPC: E05D11/08 ; E05D5/14 ; E05D7/00

Abstract:
A hinge module includes a plurality of discs, a plurality of friction plates and a restraining member. The discs are eccentrically connected to each other. Each of the friction plates has a circular hole, each of the friction plates is rotatably disposed on one of the discs through the circular hole, and the friction plates contact each other. The restraining member is disposed on the friction plates.
Public/Granted literature
- US20210254381A1 HINGE MODULE AND ELECTRONIC DEVICE Public/Granted day:2021-08-19
Information query