Invention Grant
- Patent Title: Water-cooling heat dissipation device
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Application No.: US17586720Application Date: 2022-01-27
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Publication No.: US11774177B2Publication Date: 2023-10-03
- Inventor: Tsung-Hsien Huang
- Applicant: Huizhou Hanxu Hardware Plastic Technology Co., Ltd.
- Applicant Address: CN Huizhou
- Assignee: HUIZHOU HANXU HARDWARE PLASTIC TECHNOLOGY CO., LTD.
- Current Assignee: HUIZHOU HANXU HARDWARE PLASTIC TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Guangdong
- Agent Leong C. Lei
- Priority: CN 2111571933.2 2021.12.21
- Main IPC: F28D1/02
- IPC: F28D1/02 ; F28F9/02 ; F28D21/00 ; H05K7/20

Abstract:
A water-cooling heat dissipation device includes a water-cooling radiator. The water-cooling radiator includes a radiating pipe unit, a water outlet reservoir, and a water inlet reservoir. The water-cooling radiator is provided with a first water pump and a second water pump. Each water pump is configured to pump cold water in a corresponding water outlet chamber to a corresponding water-cooling block to exchange heat and become hot water, hot water flows back to a corresponding water inlet chamber and flows into the corresponding radiating pipe unit to be cooled by radiating fins, and then cold water flows into the corresponding water outlet chamber.
Public/Granted literature
- US20230194177A1 WATER-COOLING HEAT DISSIPATION DEVICE Public/Granted day:2023-06-22
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