Invention Grant
- Patent Title: Defect size measurement using deep learning methods
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Application No.: US16881083Application Date: 2020-05-22
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Publication No.: US11774371B2Publication Date: 2023-10-03
- Inventor: Jan Lauber , Jason Kirkwood
- Applicant: KLA Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA Corporation
- Current Assignee: KLA Corporation
- Current Assignee Address: US CA Milpitas
- Agency: HODGSON RUSS LLP
- Main IPC: G01N21/95
- IPC: G01N21/95 ; G06T7/00 ; G06T11/60 ; G06T5/50

Abstract:
A system has detectors configured to receive a beam of light reflected from a wafer. For example, three detectors may be used. Each of the detectors is a different channel. Images from the detectors are combined into a pseudo-color RGB image. A convolutional neural network unit (CNN) can receive the pseudo-color RGB image and determine a size of a defect in the pseudo-color RGB image. The CNN also can classify the defect into a size category.
Public/Granted literature
- US20210364450A1 DEFECT SIZE MEASUREMENT USING DEEP LEARNING METHODS Public/Granted day:2021-11-25
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