Invention Grant
- Patent Title: Packaging of semiconductor x-ray detectors
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Application No.: US17736436Application Date: 2022-05-04
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Publication No.: US11774609B2Publication Date: 2023-10-03
- Inventor: Peiyan Cao , Yurun Liu
- Applicant: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: IPRO, PLLC
- Agent Qian Gu
- Main IPC: G01T1/24
- IPC: G01T1/24 ; H01L27/146 ; H01L31/115

Abstract:
Disclosed herein is an apparatus suitable for detecting x-ray, comprising: an X-ray absorption layer configured to generate an electrical signal from an X-ray photon incident on the X-ray absorption layer; an electronics layer comprising an electronics system configured to process or interpret the electrical signal; and an interposer chip embedded in a board of an electrically insulating material; wherein the X-ray absorption layer is bonded to the electronics layer; wherein the electronics layer is bonded to the interposer chip.
Public/Granted literature
- US20220268949A1 Packaging of Semiconductor X-Ray Detectors Public/Granted day:2022-08-25
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