In one aspect of the invention, a semiconductor packaging apparatus is provided and comprises: a bonding device for bonding a component to a substrate; a motor for driving the bonding device to operate according to a predetermined motion trajectory; a position sensor for detecting a position of the bonding device at a specific time point and generating a position signal; a motion control unit comprising a path planner for generating a position-time command for the bonding device according to a bonding process requirement, the motion control unit being configured to enable the path planner to update the position-time command based on a touch information between the component and the substrate. In a further aspect of the invention, a control algorithm for the semiconductor packaging apparatus to identify and generate the touch information is also provided, and the process control flow is optimized using the touch information.