Invention Grant
- Patent Title: Fusion memory
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Application No.: US17424998Application Date: 2019-01-28
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Publication No.: US11776607B2Publication Date: 2023-10-03
- Inventor: Hangbing Lv , Qing Luo , Xiaoxin Xu , Tiancheng Gong , Ming Liu
- Applicant: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Applicant Address: CN Beijing
- Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee Address: CN Beijing
- Agency: Westman, Champlin & Koehler, P.A.
- International Application: PCT/CN2019/073434 2019.01.28
- International Announcement: WO2020/154843A 2020.08.06
- Date entered country: 2021-07-22
- Main IPC: G11C11/22
- IPC: G11C11/22 ; H01L29/78 ; G06N3/063 ; H01L29/51 ; H10B51/20 ; H10B51/30

Abstract:
The present disclosure provides a fusion memory including a plurality of memory cells, wherein each memory cell of the plurality of memory cells includes: a bulk substrate; a source and a drain on the bulk substrate; a channel extending between the source and the drain; a ferroelectric layer on the channel; and a gate on the ferroelectric layer.
Public/Granted literature
- US20220093150A1 FUSION MEMORY Public/Granted day:2022-03-24
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