The present disclosure provides a liquid metal conductive paste and an electronic device, and relates to a technical field of new materials. The liquid metal conductive paste provided by the present disclosure includes: 1%-50% by weight of a liquid metal microcapsule, 30%-80% by weight of a conductive powder, 1%-25% by weight of a base polymer and 10%-40% by weight of a solvent. A capsule wall of the liquid metal microcapsule is made of a coating polymer, and a capsule core is made of a liquid metal. Melting point of the liquid metal satisfies: the liquid metal is in a liquid state at least when the wire made of the liquid metal conductive paste is deformed. The present disclosure can achieve a better flexible wire.