Invention Grant
- Patent Title: Distributing heatsink load across a processor module with separable input/output (I/O) connectors
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Application No.: US17157545Application Date: 2021-01-25
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Publication No.: US11776876B2Publication Date: 2023-10-03
- Inventor: Jason R. Eagle , Scott R. Lapree
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent Nathan M. Rau
- Main IPC: H01L23/433
- IPC: H01L23/433 ; H01L23/367 ; H05K7/14 ; H05K1/02 ; H01L23/40
Abstract:
A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.
Public/Granted literature
- US20220238416A1 DISTRIBUTING HEATSINK LOAD ACROSS A PROCESSOR MODULE WITH SEPARABLE INPUT/OUTPUT (I/O) CONNECTORS Public/Granted day:2022-07-28
Information query
IPC分类:
