Invention Grant
- Patent Title: Electronic module
-
Application No.: US17253076Application Date: 2018-07-04
-
Publication No.: US11776937B2Publication Date: 2023-10-03
- Inventor: Kosuke Ikeda
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2018/025308 2018.07.04
- International Announcement: WO2020/008545A 2020.01.09
- Date entered country: 2020-12-16
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/07 ; H01L23/16 ; H01L23/31

Abstract:
An electronic module has a first substrate 11; a first electronic element 13 provided on one side of the first substrate 11; a first connection body 60 provided on the one side of the first electronic element 13; a second electronic element 23 provided on the one side of the first connection body 60; and a second connection body 70 provided on the one side of the second electronic element 23. The first electronic element 13 and the second electronic element 23 do not overlap in a plane direction.
Public/Granted literature
- US20210134763A1 ELECTRONIC MODULE Public/Granted day:2021-05-06
Information query
IPC分类: