Invention Grant
- Patent Title: Semiconductor device including superlattice pattern
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Application No.: US17742985Application Date: 2022-05-12
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Publication No.: US11777001B2Publication Date: 2023-10-03
- Inventor: Ilgyou Shin , Minyi Kim , Myung Gil Kang , Jinbum Kim , Seung Hun Lee , Keun Hwi Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Fish & Richardson P.C.
- Priority: KR 20200052539 2020.04.29
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/78 ; H01L29/417 ; H01L29/10

Abstract:
A semiconductor device includes; a substrate including a first region and a second region, a first active pattern extending upward from the first region, a first superlattice pattern on the first active pattern, a first active fin centrally disposed on the first active pattern, a first gate electrode disposed on the first active fin, and first source/drain patterns disposed on opposing sides of the first active fin and on the first active pattern. The first superlattice pattern includes at least one first semiconductor layer and at least one first blocker-containing layer, and the first blocker-containing layer includes at least one of oxygen, carbon, fluorine and nitrogen.
Public/Granted literature
- US20220278204A1 SEMICONDUCTOR DEVICE INCLUDING SUPERLATTICE PATTERN Public/Granted day:2022-09-01
Information query
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