Invention Grant
- Patent Title: Fin field effect transistor (FinFET) device structure and method for forming the same
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Application No.: US17313368Application Date: 2021-05-06
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Publication No.: US11777004B2Publication Date: 2023-10-03
- Inventor: Kai-Hsuan Lee , I-Wen Wu , Chen-Ming Lee , Jian-Hao Chen , Fu-Kai Yang , Feng-Cheng Yang , Mei-Yun Wang , Yen-Ming Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/40 ; H01L29/66 ; H01L29/78 ; H01L29/49

Abstract:
A FinFET device structure is provided. The FinFET device structure includes a fin structure formed over a substrate, and a first inter-layer dielectric (ILD) layer formed over the fin structure. The FinFET device structure includes a gate structure formed in the first ILD layer, and a first S/D contact structure formed in the first ILD layer and adjacent to the gate structure. The FinFET device structure also includes a first air gap formed on a sidewall of the first S/D contact structure, and the first air gap is in direct contact with the first ILD layer.
Public/Granted literature
- US20220359683A1 FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2022-11-10
Information query
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