Invention Grant
- Patent Title: Gate-all-around structure and manufacturing method for the same
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Application No.: US17071110Application Date: 2020-10-15
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Publication No.: US11777008B2Publication Date: 2023-10-03
- Inventor: Chao-Ching Cheng , Yu-Lin Yang , I-Sheng Chen , Tzu-Chiang Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/06 ; H01L29/10 ; H01L29/66 ; H01L29/786

Abstract:
A gate-all-around structure is provided. The gate-all-around structure includes a plurality of nanostructures stacked over a substrate in a vertically direction, and the nanostructures extends from a gate region to a source/drain (S/D) region. The gate-all-around structure includes a gate structure formed in the gate region around the first nanostructures, and a S/D structure formed in the S/D region. The S/D structure is in direct contact with a top surface of one of the nanostructures.
Public/Granted literature
- US20210036119A1 GATE-ALL-AROUND STRUCTURE AND MANUFACTURING METHOD FOR THE SAME Public/Granted day:2021-02-04
Information query
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