Invention Grant
- Patent Title: Cooling in a waveguide arrangement
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Application No.: US17421764Application Date: 2019-01-11
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Publication No.: US11777188B2Publication Date: 2023-10-03
- Inventor: Anatoli Deleniv , Per Ingelhag , Peter Melin
- Applicant: Telefonaktiebolaget LM Ericsson (publ)
- Applicant Address: SE Stockholm
- Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
- Current Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
- Current Assignee Address: SE Stockholm
- Agency: Sage Patent Group
- International Application: PCT/EP2019/050640 2019.01.11
- International Announcement: WO2020/143919A 2020.07.16
- Date entered country: 2021-07-09
- Main IPC: H01Q1/02
- IPC: H01Q1/02 ; H01Q13/02 ; H01Q21/00 ; H01Q21/06 ; H01Q13/06

Abstract:
The present disclosure relates to a waveguide arrangement including a mounting printed circuit board, PCB, and at least a first waveguide layer. Each waveguide layer comprises at least a first waveguide conducting tube, each waveguide conducting tube having an electrically conducting inner wall. The PCB includes a signal interface for each waveguide conducting tube. The waveguide arrangement further includes at least a first coupling layer that is positioned between the PCB and the first waveguide conducting tube such that at least the first waveguide conducting tube of the first waveguide layer is connected to the corresponding signal interface via the first coupling layer.
Public/Granted literature
- US20220094032A1 COOLING IN A WAVEGUIDE ARRANGEMENT Public/Granted day:2022-03-24
Information query