An electronic assembly including: a housing for enclosing electronic components within. The housing includes an opening; an input-output port for allowing connection of at least one of the electronic components with at least one input-output device. The input-output port extends through the opening; and a flexibly resilient material integrated with the housing and arranged to partially cover the opening. The flexibly resilient material being dimensioned to complement the dimensions of the input-output port. Also provided is a method of producing the electronic assembly.