Invention Grant
- Patent Title: Connection body of high-temperature superconducting wire materials and connecting method
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Application No.: US16419778Application Date: 2019-05-22
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Publication No.: US11777269B2Publication Date: 2023-10-03
- Inventor: Xinzhe Jin , Yoshinori Yanagisawa , Renzhong Piao , Yu Suetomi
- Applicant: RIKEN
- Applicant Address: JP Wako
- Assignee: RIKEN
- Current Assignee: RIKEN
- Current Assignee Address: JP Wako
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 18184184 2018.09.28
- Main IPC: H01R43/02
- IPC: H01R43/02 ; H01R4/68 ; H10N60/01 ; H10N60/85

Abstract:
Provided is a connection body of high-temperature superconducting wire materials including a first oxide high-temperature superconducting wire material and a second oxide high-temperature superconducting wire material, characterized in that a first superconducting layer of the first oxide high-temperature superconducting wire material and a second superconducting layer of the second oxide high-temperature superconducting wire material are bonded together via a junction including M-Cu—O (wherein M is a single metal element or a plurality of metal elements included in the first superconducting layer or the second superconducting layer). The connection body may be, for example, a connection body of Bi2223 wire materials, and the junction may include CaCuO2.
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