Invention Grant
- Patent Title: Semiconductor laser
-
Application No.: US17257662Application Date: 2018-09-12
-
Publication No.: US11777277B2Publication Date: 2023-10-03
- Inventor: Kyosuke Kuramoto
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2018/033763 2018.09.12
- International Announcement: WO2020/053980A 2020.03.19
- Date entered country: 2021-01-04
- Main IPC: H01S5/16
- IPC: H01S5/16 ; H01S5/042 ; H01S5/32 ; H01S5/323

Abstract:
A semiconductor laser comprises a window structure part including a low resistance active layer formed in end face regions, to have a lower resistance than an active layer located inward with respect to the end face regions. A length between the front end of the contact layer and the front end face is longer by 10 μm or more than a length of a front-end-face side window structure part, and is shorter than a length between the front end face and the rear end of the contact layer. A length between an end of a rear side electrode on the side of the front end face and the front end face is 1.2 times or more a substrate thickness of a substrate, and is shorter than a length between the front end face and an end of the rear side electrode on the side of the rear end face.
Public/Granted literature
- US20210273410A1 SEMICONDUCTOR LASER Public/Granted day:2021-09-02
Information query