Invention Grant
- Patent Title: Acoustic wave device, high-frequency front end circuit, and communication device
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Application No.: US17242457Application Date: 2021-04-28
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Publication No.: US11777471B2Publication Date: 2023-10-03
- Inventor: Masakazu Mimura , Kazuhiro Takigawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: KEATING & BENNETT, LLP
- Priority: JP 17006106 2017.01.17
- Main IPC: H03H9/145
- IPC: H03H9/145 ; H03H9/02 ; H03H9/25 ; H03H9/64 ; H03H9/72 ; H03F3/20 ; H04B11/00 ; H10N30/87 ; H10N30/853

Abstract:
An acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate and includes a main electrode layer. In the IDT electrode, a central region, first and second low acoustic velocity regions and first and second high acoustic velocity regions are disposed in this order. A duty ratio in the first low acoustic velocity region of first electrode fingers and the second low acoustic velocity region of second electrode fingers is larger than a duty ratio in the central region. The main electrode layer includes any one of Au, Pt, Ta, Cu, Ni, and Mo as a main component.
Public/Granted literature
- US20210250013A1 ACOUSTIC WAVE DEVICE, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION DEVICE Public/Granted day:2021-08-12
Information query
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