Invention Grant
- Patent Title: Signal transmission circuit packaging structure
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Application No.: US17505904Application Date: 2021-10-20
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Publication No.: US11778732B2Publication Date: 2023-10-03
- Inventor: Miaobin Gao , Chia-Chi Hu
- Applicant: LeRain Technology Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: LERAIN TECHNOLOGY CO., LTD.
- Current Assignee: LERAIN TECHNOLOGY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW 0118531 2021.05.21
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H04B1/40

Abstract:
A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins and ground pins. The main circuit unit is arranged in the center of the body. The power pins are arranged in the center of the body. The input pins are arranged at a first side of the body and are electrically connected to the main circuit unit. The output pins are arranged at a side of the body opposite to the first side and are electrically connected to the main circuit unit. The control pins are arranged at a second side of the body and are electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins and the control pins.
Public/Granted literature
- US20220376443A1 SIGNAL TRANSMISSION CIRCUIT PACKAGING STRUCTURE Public/Granted day:2022-11-24
Information query