Invention Grant
- Patent Title: Expansion card with mezzanine level connector
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Application No.: US17687548Application Date: 2022-03-04
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Publication No.: US11778743B2Publication Date: 2023-10-03
- Inventor: Ieuan James Mackereth Marshall , Robert Andrew Daniels
- Applicant: XILINX, INC.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/02

Abstract:
An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the bracket. The secondary substrate has a termination of the first communication port.
Public/Granted literature
- US20230284384A1 Expansion card with mezzanine level connector Public/Granted day:2023-09-07
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