- Patent Title: Mounting structure and manufacturing method of mounting structure
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Application No.: US17466436Application Date: 2021-09-03
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Publication No.: US11778749B2Publication Date: 2023-10-03
- Inventor: Kyoko Otsuka
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 20159316 2020.09.24
- Main IPC: H05K1/18
- IPC: H05K1/18 ; G06F1/16 ; H05K3/36 ; H05K1/02

Abstract:
To provide a mounting structure in which a connection unit is protected and a non-flexible region is small, the mounting structure includes a flexible wiring board, a non-flexible component, and a connection unit provided in a region smaller than a bottom face of the non-flexible component and connecting the flexible wiring board and the non-flexible component. The mounting structure includes a protection resin sealing the connection unit in such a way that the flexible wiring board and the non-flexible component are separable. The protection resin covers only a region where the connection unit is provided. To a face of the flexible wiring board, being on an opposite side to the connection unit, a reinforcing material is added. The reinforcing material covers a region where the connection unit is provided and being narrower than the bottom face of the non-flexible component.
Public/Granted literature
- US20220095460A1 MOUNTING STRUCTURE AND MANUFACTURING METHOD OF MOUNTING STRUCTURE Public/Granted day:2022-03-24
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