Invention Grant
- Patent Title: Casing and manufacturing method thereof
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Application No.: US17087634Application Date: 2020-11-03
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Publication No.: US11778766B2Publication Date: 2023-10-03
- Inventor: Wen-Hsin Lin , Cheng-Nan Ling , Wen-Chieh Tai
- Applicant: Acer Incorporated
- Applicant Address: TW New Taipei
- Assignee: Acer Incorporated
- Current Assignee: Acer Incorporated
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW 9117484 2020.05.26
- Main IPC: H05K5/04
- IPC: H05K5/04 ; B23K26/362 ; B24B19/02 ; C25D13/20

Abstract:
A manufacturing method of a casing including the following steps is provided. A magnesium alloy substrate is provided first. Next, a protective film is formed on the magnesium alloy substrate. A grinding treatment, a cutting treatment, or an engraving treatment is then performed to remove portions of the protective film and portions of the magnesium alloy substrate. An electrophoretic coating treatment is performed afterwards to form a light-transmissive coating layer covering the protective film and the magnesium alloy substrate. A casing is also provided.
Public/Granted literature
- US20210378118A1 CASING AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-12-02
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