Invention Grant
- Patent Title: High-speed performance electrical connector for modular electronics systems
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Application No.: US17408312Application Date: 2021-08-20
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Publication No.: US11778768B2Publication Date: 2023-10-03
- Inventor: Richard G. Baldwin, Jr. , Dennis Vance Toth
- Applicant: NATIONAL INSTRUMENTS CORPORATION
- Applicant Address: US TX Austin
- Assignee: National Instruments Corporation
- Current Assignee: National Instruments Corporation
- Current Assignee Address: US TX Austin
- Agency: Kowert, Hood, Munyon, Rankin & Goetzel, P.C.
- Agent Jeffrey C. Hood
- Main IPC: H05K7/14
- IPC: H05K7/14 ; G06F1/18 ; H01R12/70

Abstract:
A connector gap between a module connector mating surface and the backplane connector of a chassis may be eliminated through a mechanism that forcefully pushes (or pulls) the module towards the backplane and/or forcefully pushes (or pulls) the backplane toward the module. A spring-loaded or resilient element may be used to fasten the module in a way that effectively fills any designed-in and tolerance-induced gap in the connector interface, allowing the connector to fully seat. In addition, a gasket or other compressible member may be included at the connector mating interface. The gap in the connector interface may be reduced by introducing adjustable card cage members that are capable of being set during the assembly or manufacturing process using special alignment fixtures. The gap in the connector interface may also be reduced by introducing a higher tolerance capable manufacturing process, such as machining, to the card cage sub-assembly.
Public/Granted literature
- US20220061181A1 High-Speed Performance Electrical Connector for Modular Electronics Systems Public/Granted day:2022-02-24
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