Invention Grant
- Patent Title: Light-emitting diode structure, fabrication method therefor, and display panel
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Application No.: US17043163Application Date: 2019-07-26
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Publication No.: US11778855B2Publication Date: 2023-10-03
- Inventor: Zhuo Chen
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Dilworth & Barrese, LLP.
- Agent Michael J. Musella, Esq.
- Priority: CN 1810834313.5 2018.07.26
- International Application: PCT/CN2019/097896 2019.07.26
- International Announcement: WO2020/020341A 2020.01.30
- Date entered country: 2020-09-29
- Main IPC: H10K50/854
- IPC: H10K50/854 ; H01L25/075 ; H01L33/06 ; H01L33/14 ; H01L33/38 ; H10K50/15 ; H10K50/16 ; H10K50/17 ; H10K50/115 ; H10K50/818 ; H10K50/822 ; H10K50/828 ; H10K71/00 ; H10K102/10 ; H10K102/00

Abstract:
A light-emitting diode structure, a fabrication method therefor, and a display panel. The light-emitting diode structure includes: a base substrate; and a first electrode layer, a light-emitting layer and a second electrode layer that are successively stacked on the base substrate, wherein the second electrode layer includes a first coarse surface that is located at a side far from the base substrate.
Public/Granted literature
- US20210193876A1 LIGHT-EMITTING DIODE STRUCTURE, FABRICATION METHOD THEREFOR, AND DISPLAY PANEL Public/Granted day:2021-06-24
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